Abstract: An ion source is described in which a compound of the material of a desired ion is dissociated in a plasma discharge process to provide a beam of charged particles including the desired ions. The proportion of the desired ion in the particle beam is selected by adjustment of the temperature of the plasma, and, for increasing the range of selection of obtainable proportions, various means are described for increasing the plasma temperature beyond that which was previously attainable in ion sources of this type.

Abstract: An unpierced metallic billet of relatively large diameter is subjected to three successive stages of deformation so as to form a metallic tube of relatively small outer diameter. In a first stage, the billet is given a generally "C"-shaped cross-sectional configuration. In a second stage, the diameter of the generally "C"-shaped cross-section is reduced and, simultaneously, the ends of the generally "C"-shaped cross-section are guided toward and then into contact with one another. In a third stage, the contacting ends are welded together. The three stages of deformation take place in a single die through which the billet is continuously hydrostatically extruded, the hydrostatic extrusion process utilizing a deoxidizing, lubricating, shear transmitting medium in displacing the billet through the die.

Abstract: A shadow mask particularly useful in ion implantation processes is disclosed. The mask is fabricated by doping a surface region of a semiconductor wafer to render that region resistant to a particular etchant, machining cavities in the surface of the wafer opposite the doped surface to a depth that does not quite reach the doped region, forming pattern openings in the webs remaining across the ends of the cavities, and thinning the webs by exposure to the particular etchant until the undoped material in the webs is removed. Thus, the ultimate thickness of the webs is controlled substantially by the doping depth.

Abstract: In the manufacture of certain types of electronic devices, a plurality of leads are simultaneously bonded in side-by-side relation to a corresponding number of "active" bonding sites or pads on a substrate, the "active" pads being the ends of conductive paths on the substrate. Particularly narrow active bonding pads are used to minimize the possibility of shorting together adjacent pads by leads which are not properly aligned on centers with the pads. Electrically isolated "dummy" pads, comprising relatively small metallized areas are not connected to conductive paths, are provided on the substrate between each active pad. Portions of the misaligned leads extending beyond the edges of the active pads overlap and are bonded to the dummy pads, thus minimizing the loss of bonding strength otherwise caused by the misalignment of the leads with the active pads.

Abstract: Parameters of a clad optical fiber are measured by irradiating the fiber with a laser beam to generate a scattering pattern. Measurements are made of fringes and modulations in the scattering pattern and these measurements are translated into such parameters as core and fiber diameter.

Abstract: To eliminate the manual handling of individual articles associated with loading and unloading conventional treating apparatus, a plurality of articles are simultaneously treated in the carriers which are used for batch handling prior to and subsequent to the treating operation. In a disclosed embodiment, wafer-shaped articles are held in mutually spaced substantially parallel relationship in a plurality of slots in a first carrier having an open face through which the wafers can be inserted and removed. The open face of the first carrier is abutted to the open face of an empty second carrier having at least a corresponding plurality of slots, such that the slots of the first carrier are aligned with the slots of the second carrier. The abutted carriers, with the wafers contained therein, are submersed in a treating medium and rotated about an axis running through the abutted faces of the carriers.

Abstract: Wafer-like articles are inserted through an input port into one of a plurality of slots in a rotatable disc having a slotted periphery. The disc is disposed in a vertical plane between a pair of closely-spaced parallel plates which laterally retain the articles in the slots. The slots advantageously are inclined toward the direction of rotation so that the wafers tend to remain therein as rotation and treating proceeds. The rotating disc urges each article between the plates to an aperture in one of the plates through which one side of the article is exposed to a treating medium, such as a scrubbing brush and detergent solution. Further rotation of the disc brings each article to an aperture in the opposing plate through which another side of the article is exposed to another treating medium of like or different kind.

Abstract: A method of precisely aligning a pattern on one side of an opaque substrate with a pattern on the opposite side thereof through the use of pattern-defining masks, wherein at least certain pattern areas previously not formed on the substrate, as defined selectively through the masks, are formed while the masks are aligned. The first mask is releasably secured to a first side of the substrate so as to define a particular orientation of a desired pattern therethrough, and is dimensioned such that at least one, but preferably several spaced peripheral areas thereof extend beyond adjacent peripheral edge portions of the wafer, with the extended mask areas including alignment indicia. A second mask is then positioned against a second side of the substrate, and is constructed with one or more outwardly extending peripheral areas and respectively associated alignment indicia corresponding in number, and spatial relationship, with those in the first mask.

Abstract: Device leads are compliantly bonded and external leads are directly bonded to a substrate with a single stroke of a bonding tool. The external leads are comprised in a lead frame that includes a compliant medium portion for bonding the device leads.

Abstract: In a non-destructive, production-oriented technique for measuring an electrical characteristic of a material, a first nonconductive flexible sheet having a first conductive pattern thereon is pressed against a portion of the surface of the material, and a second nonconductive flexible sheet having a second conductive pattern thereon is pressed against another portion of the surface of the material. An electrical signal is applied between the two patterns and the effect of the material on the signal is measured to obtain a desired electrical characteristic of the material. The method and apparatus are particularly useful for measuring, at microwave frequencies, the propogation velocity factor and dielectric constant of substrates for use in thin film microwave circuits. For such measurements, the first and second conductive patterns advantageously comprise a resonant circuit and a ground plane.