Abstract: A surface mountable electronic device has a case with an opening, an electronic element contained inside the case such as a thermistor or a varistor that generates heats when in operation, a plurality of elongated spring terminals supporting this electronic element elastically together and each sandwiching a wall of the case both from inside and outside at a peripheral edge part of the wall at its opening, and a lid attached to the case so as to close up its opening except where the spring terminals pass through the opening. Grooves are preferably formed at peripheral edge parts of the wall where the spring terminals are fitted, contacting the wall such that heat generated by the electronic element during its operation and propagating through the spring terminals can be effectively conducted to the main body of the case and diverted from its soldered junctures with a circuit board.

Abstract: A system for transporting in a vacuum chamber sample holders and samples between a holder tray and a location for use with a surface analytical instrument is disclosed. Also provided is a system including a microwave coaxial cable connecting the tip terminal of a scanning tunneling microscope to a microwave signal source and a system for clamping a heater to a sample holder in order to heat the sample.

Abstract: A compact multi-stage dielectric resonator apparatus is formed either by placing two or more axially elongated inner conductors axially separated from each other inside a throughhole through a dielectric block such that the mutually separated inner conductors are coupled capacitively across an electrode-free region which separates them and a multi-stage resonator is thereby formed, or by attaching a plurality of single-stage dielectric resonators to such a multi-stage resonator to form a unistructural apparatus. Each of these single-stage dielectric resonators has a dielectric block with a throughhole containing an axially extending inner conductor. Outer surfaces of the resonators are substantially entirely covered by outer conductors but openings in the outer conductor and coupling-providing conductors insulated from and entirely surrounded by the outer conductor are provided for magnetically and electrostatically coupling the resonators which are attached together.

Abstract: A process for forming a stress relief layer on a semiconductor die and the resulting structure of the process is described. The stress relief layer is formed on a surface of a die which has already been attached to a die attach pad of a lead frame by a cured epoxy. The purpose of the layer is to act as a stress relief buffer by relieving the die surface from contraction forces created by a plastic material used for encapsulating the die and die attach pad portion of the lead frame, as the plastic material cools following hot injection molding of the material to form the encapsulation. Prior to application of the stress relief material onto the surface of the die, the surface is cleaned to restore its high surface energy. The stress relief material is formed by diluting a silicone compound with a non-reactive diluent such as a silicone oil so that both the surface energy and viscosity of the silicone compound is reduced.