Abstract: Provided is a method and system for controlling a fabrication cluster for processing of a substrate in an etch process, the fabrication cluster having equipment settings and process parameters. A correlation of etch stage measurements to actual etch stage data is developed, the etch stage measurements comprising measurements using two or more optical metrology devices and an etch sensor device. An etch stage value is extracted using the developed correlation and the etch stage measurement. If the etch stage measurement objectives are not met, the metrology devices are modified, a different etch sensor device is selected, the etch stage measurements are enhanced, and/or the correlation algorithm is refined. The steps are iterated until the etch stage measurement objectives are met. The extracted etch stage value is used to adjust an equipment setting and/or process parameter of the fabrication cluster.

Abstract: Provided is a method for designing an etch stage measurement system involving an etch process for one or more layers on a substrate using an etch process tool. The etch process tool uses two or more metrology devices, at least one etch process sensor device, and a metrology processor, the etch stage measurement system configured to meet two or more etch stage measurement objectives. A correlation algorithm using the etch stage measurements to the actual etch stage data is developed and used to extract etch measurement value. If the set two or more etch stage measurement objectives are not met, the optical metrology devices are modified, a different etch process sensor device is selected, the correlation algorithm is refined, and/or the measurement data is enhanced by adjusting for noise.

Abstract: Provided is a system for measuring an etch stage of an etch process involving one or more layers in a substrate, the etch stage measurement system configured to meet two or more etch stage measurement objectives. The system includes an etch process tool, the etch process tool having an etch chamber, a controller, and process parameters. The etch process tool is coupled to two or more optical metrology devices and at least one etch sensor device measuring an etch process parameter with high correlation to the etch stage. The processor is coupled to the etch process tool and is configured to extract an etch measurement value using a correlation of etch stage measurements to actual etch stage data and etch stage measurement obtained from the two or more metrology devices and the at least one etch process sensor device.

Abstract: A first wafer is fabricated using a first value for a process parameter specifying a process condition in fabricating the structure. A first value of a dispersion is measured from the first wafer. A second wafer is fabricated using a second value for the process parameter. A second value of the dispersion is measured from the second wafer. A third wafer is fabricated using a third value for the process parameter. The first, second, and third values for the process parameter are different from each other. A third value of the dispersion is measured from the third wafer. A dispersion function is defined to relate the process parameter to the dispersion using the first, second, and third values for the process parameter and the measured first, second, and third values of the dispersion. The simulated diffraction signal is generated using the defined dispersion function. The simulated diffraction signal is stored.

Abstract: Provided is an apparatus for projecting multiple beams to a structure on a workpiece comprising a first light source generating a first illumination beam and a second light source generating a second illumination beam, an illumination primary mirror configured to reflect the first illumination beam onto the structure of the workpiece at a first angle of incidence, generating a first detection beam, and configured to reflect the second illumination beam onto the workpiece at a second angle of incidence, generating a second detection beam, a separate illumination secondary mirror positioned relative to the illumination primary mirror so as make the first angle of incidence substantially the same or close to a calculated optimum first angle of incidence and make the second angle of incidence substantially the same or close to a calculated optimum second angle of incidence.

Abstract: Provided is a method of controlling multiple beams directed to a structure in a workpiece, the method comprising generating a first illumination beam with a first light source and a second illumination beam with a second light source, projecting the first and second illumination beams onto a separate illumination secondary mirror, reflecting the first and second illumination beams onto an illumination primary mirror, the reflected first and second illumination beams projected onto the structure at a first and second angle of incidence respectively, the reflected first and second illumination beams generating a first and second detection beams respectively. The separate illumination secondary mirror is positioned relative to the illumination primary mirror so as make the first angle of incidence substantially the same or close to a calculated optimum first angle of incidence and make the second angle of incidence substantially the same or close to a calculated optimum second angle of incidence.

Abstract: To manage data flow in generating profile models for use in optical metrology, a project data object is created. A first profile model data object is created. The first profile model data object corresponds to a first profile model defined using profile parameters. A version number is associated with the first profile model data object. The first profile model data object is linked with the project data object. At least a second profile model data object is created. The second profile model data object corresponds to a second profile model defined using profile parameters. The first and second profile models are different. Another version number is associated with the second profile model data object. The second profile model data object is linked with the project data object. The project data object, the first profile model data object, and the second profile model data object are stored.