Abstract: An amusement ride vehicle includes a first vehicle section, a second vehicle section, and an articulation joint connecting, and providing rotational movement between, the first and second vehicle sections. The articulation joint comprises a first shaft for bearing loads during normal operation of the joint, and a second shaft within the first shaft for bearing loads when the first shaft is inoperable. A test element, such as a lever, is attached to the second shaft. The second shaft is rotatable via the test element during normal operation of the joint. When the first shaft is inoperable, the second shaft handles loads acting on the articulation joint, and is not rotatable via the test element, thus indicating a failure of the first shaft.
Type:
Grant
Filed:
September 28, 2004
Date of Patent:
January 9, 2007
Assignee:
Universal City Studios LLP
Inventors:
Joseph Casey, Cindy Emerick, Ben Lovelace, Frank Weigand, Bill Whitcomb, Jim Seay, Glen Hartung
Abstract: A surface mount package for a multi-chip device has a leadframe formed with first and second die pads and readouts from the respective die pads. An environmentally responsive sensor chip is secured to the first die pad and an environmentally isolated chip is secured to the second die pad. The chips are electrically coupled through the lead frame. A body formed with an over molded portion encases the isolated chip and an open molded portion formed with a recess receives the environmentally sensitive chip. An apertured cover is secured in the recess to form a protective covering over the sensor chip and for allowing communication of the sensor chip externally of the package.
Type:
Grant
Filed:
February 8, 2005
Date of Patent:
January 2, 2007
Assignee:
General Electric Company
Inventors:
Woojin Kim, John Dancaster, John Logan, Aniela Bryzek
Abstract: A multi-processor arrangement having an interprocessor communication path between each of every possible pair of processors, in addition to I/O paths to and from the arrangement, having signal processing functions configurably embedded in series with the communication paths and/or the I/O paths. Each processor is provided with a local memory which can be accessed by the local processor as well as by the other processors via the communications paths. This allows for efficient data movement from one processor's local memory to another processor's local memory, such as commonly done during signal processing corner turning operations. The configurable signal processing logic may be configured to host one or more signal processing functions to allow data to be processed prior to its deposit into local memory.