Abstract: A sidebrazed ceramic package is provided with a closure seal that employs a high alumina ceramic lid that matches the composition of the package body. The lid is provided with a recess in the sealing face and the sealing face is provided with metallization that adheres to the ceramic and is wet by solder. The metallized ceramic lid is sealed to the metallization ring on the sidebrazed ceramic body by means of the conventional gold-tin solder. The resultant hermetic seal can be insepcted by observing the solder fillet in the lid recess. Such a closure seal is fully hermetic and can readily survive repeated thermal cycling.

Abstract: A method of fabricating polycrystalline silicon resistors having nearly zero or positive temperature coefficient includes the steps of depositing a layer of polycrystalline silicon, implanting the layer with silicon to make the layer substantially amorphous, introducing an impurity to dope the layer, and annealing the layer.

Abstract: A CMOS current sense amplifier is composed of an output inverter gate, a combined driver and biasing stage that biases the output inverter gate and drives its transistors, and an input stage that acts to reduce the input voltage swing. The circuit responds rapidly to input current changes and is therefore useful in sensing the currents in large memory arrays that have large shunt capacitance values.