Abstract: The present invention provides antifuse structures having an integrated heating element and methods of programming the same, the antifuse structures comprising first and second conductors and a dielectric layer formed between the conductors, where one or both of the conductors functions as both a conventional antifuse conductor and as a heating element for directly heating the antifuse dielectric layer during programming.
Type:
Grant
Filed:
November 12, 2004
Date of Patent:
January 29, 2008
Assignee:
International Business Machines Corporation
Inventors:
Byeongju Park, Subramanian S. Iyer, Chandrasekheran Kothandaraman