Patents Represented by Attorney, Agent or Law Firm Mark Kusper
  • Applying resistive layer onto copper
    Patent number: 6489035
    Abstract: A sheet material, comprised of a copper foil treated to have a stabilization layer thereon. The stabilization layer is comprised of zinc oxide, chromium oxide or a combination thereof having a thickness between about 5 Å and about 70 Å. A vapor deposited resistive material is provided on the stabilization layer.
    Type: Grant
    Filed: July 31, 2000
    Date of Patent: December 3, 2002
    Assignee: Gould Electronics Inc.
    Inventors: Jiangtao Wang, John Callahan, Dan Lillie