Abstract: A method for making a semiconductor device is described. In that method, a metal layer is formed on a dielectric layer, which is formed on a substrate. After forming a masking layer on the metal layer, the sides of the masking layer are lined with a sacrificial layer.
Type:
Grant
Filed:
March 22, 2004
Date of Patent:
May 17, 2005
Assignee:
Intel Corporation
Inventors:
Uday Shah, Mark L. Doczy, Justin K. Brask, Jack Kavalieros, Matthew V. Metz, Robert S. Chau