Abstract: A printed circuit board package for high density packaging of electronic circuit components is disclosed. The circuit components are cooled by a liquid cooled, cold plate with a compliant mat interface. The interface is made of a heat conductive, electrically insulative compliant structure, such that uniform contact can be made with the circuit components, even if there are differences in the relative heights and shapes of the components.

Abstract: A method of addressing memory in a digital computer where a plurality of devices are connected to a single input/output channel to the digital computer communicate with the digital computer by externally specifying the memory address of the data word or words to be transferred to or from the digital computer. More specifically, the invention provides a method for treating the externally specified address coming from one of the multiple devices external to the digital computer as a virtual address. Thus, an input/output process operating in the digital computer may operate within the digital computer's system virtual address space. This method allows input/output processes to be able to utilize the address mapping subsystem of the central processor of the digital computer. The method of memory addressing utilizes a subchannel page table for each one of the multiple devices connected to one input/output channel in addition to a channel page table utilized for each individual input/output channel.