Abstract: The present invention is directed to a method and apparatus for intermittently applying particulate material to a substrate. A continuous supply of particulate material is provided from a supply source to a valve having a powder application phase and a recycle phase. The valve is disposed to the powder application phase to allow particulate material to pass therethrough and to fall freely onto at least a portion of the substrate. The valve is disposed in the recycle phase to prevent dispensing of the particulate material onto the substrate and to retain the particulate material within the valve to be conveyed back to the supply source.