Patents Represented by Attorney, Agent or Law Firm Marvell Semiconductor, Inc.
  • Semiconductor device power distribution system and method
    Patent number: 6770982
    Abstract: An integrated circuit power distribution system and method is provided. The integrated circuit comprises a semiconductor die that includes at least one pair of bond pads having a single bond wire connected thereto such that each bond pad of the pair of bond pads has only one bond wire end connected thereto. A first bond pad of the pair of bond pads is located in an internal portion of the semiconductor die. A first wire having a first end and a second end is electrically connected between the pair of bond pads.
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: August 3, 2004
    Assignee: Marvell International, Ltd.
    Inventor: Shiann-Ming Liou