Abstract: A method for self-calibrating a sensor can be implemented in a system having a calibration circuit. The calibration circuit has differential circuitry which compares an output signal of the sensor with a predetermined reference signal associated with a reference property. A bias controller increments or decrements the sensor operating bias according to the deviation between the predetermined reference signals and sensor output signal such that the sensor output corresponds to the predetermined reference voltage. The calibration circuit can be embedded in the sensor to provide a self-calibrating sensor. Logic circuitry can be used to form the calibration circuit.

Abstract: A thermal fluid flow sensor and method of forming same. The flow sensor has an integrated circuit substrate, such as a silicon substrate, and a region of low thermal conductivity material carried on the top surface of the integrated circuit substrate. One or more pairs of temperature sensing elements are disposed on the low thermal conductivity region together with a heating element so that a robust flow sensor can be provided at low cost. Signal conditioning circuitry is disposed on the same surface as the temperature sensing elements and connected to the sensing elements thereby further reducing costs and improving the flow sensor sensitivity.

Abstract: A wireless pressure sensor system has a pressure sensing capacitor and an inductor mounted on a common housing. The pressure sensing capacitor has a conductive diaphragm, a dielectric layer and a fixed electrode separated at least in part from the diaphragm by a gap formed in the housing. The electrode is arranged with a protrusion such that displacement of the diaphragm varies the area of capacitive contact with the electrode by rolling along the protrusion. The inductor coil and pressure sensing capacitor are connected to form a passive inductive-capacitive (LC) tank circuit. A remote interrogation circuit, inductively coupled to the pressure sensor inductor coil can be utilized to detect the resonant frequency of the LC tank which varies as a function of pressure sensed by the diaphragm.

Abstract: A plastic substrate can be provided and thereafter a plurality of metal-to-metal connections can be ultrasonically bonded to the plastic substrate. One or more dies and a plurality of conductive components thereof can then be respectively connected to the metal-to-metal connections in order to provide a plastic leadframe package structure that includes electronic circuitry thereon. The plurality of conductive components can be configured as discrete components, while the die itself can be configured as a Flip Chip On Plastic Leadframe component. By utilizing plastic as the basis for a substrate and, ultrasonic bonding of the metal-to-metal connections, a complex substrate formed from plastic can provide a structure, particularly a plastic leadframe structure, that allows for the use of parts and components that are much less expensive than presently utilized parts and components.