Abstract: Input signals are electronically watermarked using an uneven or non-uniform sampling rate. The uneven or non-uniform sampling may be pseudo-random. The uneven or non-uniform sampling meets the Nyquist criterion so that aliasing and loss of content are avoided. The resulting sampling pattern in the sampled data is detectable by a comparison with the original source data.

Abstract: A program feature set is compared to a processor feature set. The comparison may be performed in response to restoring the program onto a system or requesting its execution. The processor feature set represents zero, one or more optional hardware features supported by the processor, whereas the program feature set represents zero, one or more optional hardware features the program relies upon in its generated code. Comparison of the feature sets determines whether a particular program may run on a particular processor. Programs may be automatically or manually rebuilt to achieve full compatibility. If the comparison indicates that the program requires a feature not supported by the processor, the program is rebuilt based on the processor feature set. Alternatively, the program may be rebuilt in response to a rebuild request, rather than the comparison. The program is preferably rebuilt from an intermediate representation (IR) stored with or locatable from the program.

Abstract: An operating system kernel includes an attach mechanism and a detach mechanism. In addition, processes are tagged with an access attribute identifying the process as either a client process or a server process. Based on the access attribute, the operating system kernel lays out the process local address space differently depending on whether the process is a client process or a server process. A server process can “attach” to a client process and reference all of the client process' local storage as though it were its own. The server process continues to reference its own process local storage, but in addition, it can reference the other storage, using the client process' local addresses. When access to the other storage is no longer needed, the server process can “detach” from the client process. Once detached, the other storage can no longer be referenced.

Abstract: A chip module heat transfer apparatus includes one or more chips electronically connected to a module substrate by controlled collapse chip connection (C4) solder joints. The module substrate, which is preferably an FR-4 laminate or other organic substrate, has cut-out channels formed thereon. A permanent solder mask is laminated over the cut-out channels to form thermal dissipation channels, which are in fluid communication with input and output ports. The C4 solder joints include solder balls that electronically connect terminals on the chips to corresponding attach pads on the substrate that are exposed through the mask. The thermal dissipation channels extend along rows of attach pads. A cooling fluid, such as inert perfluorocarbon fluid, flows through the thermal dissipation channels to remove heat and to mitigate strain on the solder balls due to coefficient of thermal expansion (CTE) mismatch between the chips and the substrate.

Abstract: A dummy node is enqueued to a concurrent, non-blocking, lock-free FIFO queue only when necessary to prevent the queue from becoming empty. The dummy node is only enqueued during a dequeue operation and only when the queue contains a single user node during the dequeue operation. This reduces overhead relative to conventional mechanisms that always keep a dummy node in the queue. User nodes are enqueued directly to the queue and can be immediately dequeued on-demand by any thread. Preferably, the enqueueing and dequeueing operations include the use of load-linked/store conditional (LL/SC) synchronization primitives. This solves the ABA problem without requiring the use a unique number, such as a queue-specific number, and contrasts with conventional mechanisms that include the use of compare-and-swap (CAS) synchronization primitives and address the ABA problem through the use of a unique number.

Abstract: A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).

Abstract: A vented door for a computer system includes a vented base and an outer door. The vented base and the outer door are separately pivotable. The vented base is pivotably attached to the computer system's enclosure for movement between a closed configuration where the vented base abuts against a panel of the enclosure and an open configuration where the vented base is swung away from the panel. The outer door is pivotably attached to the vented base to avoid interfering with a neighboring computer system's vented door as the vented base is pivoted to the open configuration. An acoustic noise reduction lining is provided on the outer door and in the air flow apertures of the vented base. The outer door is preferably removable from the vented base so that the combined weight of the vented base and the outer door need not be lifted when removal is necessary.

Abstract: An enhanced space allocation mechanism (ESAM) for dynamically allocating space for a fixed length part of variable length fields, such as VARCHAR fields, in database tables. Each record in such a variable length field has a fixed length part, a variable length part, and a pointer to the variable length part. The ESAM determines how much space to allocate based on the data that was historically put into these tables. In one embodiment, a database management system (DBMS) maintains a historical record that includes fields identifying the table, column and application ID, as well as fields that track a count and a total length.

Abstract: A vented cover includes a pair of cross-flow ventilation ducts each including an acoustic noise reduction lining. The ducts are “cross-flow” in that they cross and bypass one another. The cover is affixed to an enclosure containing components of a computer system and abuts against a panel of the enclosure having an airflow aperture. An air moving device (AMD) passes air through the enclosure from the ducts if the cover is an intake cover, and/or into the ducts if the cover is an exhaust cover. The ducts increase the air path length, and the acoustic absorbing surface, thereby increasing acoustic attenuation. Airflow resistance is reduced by reducing surfaces perpendicular and close to the area where air enters and by reducing sharp turns in the ducts. The cover has a relatively thin depth because the ducts cross and bypass each other in a very space efficient manner.

Abstract: A method of providing rebroadcast programming includes encoding a rebroadcast program, specifying a preferred play time, and providing a broadcast that fits the preferred play time. The encoding of the rebroadcast program can use a replay plan which prioritizes portions of the rebroadcast. A priority can be assigned to commercials which have been made to be shortened or dropped, or an alternative commercial substituted, depending on time limitations. A rebroadcast packaging and playlist are provided.

Abstract: Input signals are electronically watermarked using an uneven or non-uniform sampling rate. The uneven or non-uniform sampling may be pseudo-random. The uneven or non-uniform sampling meets the Nyquist criterion so that aliasing and loss of content are avoided. The resulting sampling pattern in the sampled data is detectable by a comparison with the original source data.

Abstract: An enhanced contact construction and loading support mechanism for plastic land grid array (PLGA) modules. A plurality of inverted hybrid land grid array (LGA) contacts are each respectively captured in and extend at least partially through one of a plurality of holes of an inverted hybrid LGA interposer. The inverted hybrid LGA contacts are affixed to a plurality of metal pads on a PLGA module carrier. Preferably, the inverted hybrid LGA contacts are affixed simultaneously using surface-mount technology (SMT) and have a metallurgy construction (e.g., beryllium-copper springs coated with nickel and hard gold) that provides enhanced wear and corrosion resistance. Each of the inverted hybrid LGA contacts is configured to make mechanical/pressure contact with a metal contact on another substrate, such as a printed wiring board (PWB).

Abstract: A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

Abstract: A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material having an opening formed at its base through which the heat sink makes thermal contact with an electronic module mounted on the PCB. The base makes electrical contact with a peripheral surface of the heat sink, and multiple-jointed spring fingers extend from the base to make electrical contact with conductive pads on the PCB. During compression, the movement of each spring finger's tip is substantially limited to the z-axis. Accordingly, the final installed location of the tip can be precisely controlled even when the grounding spring must accommodate a wide variety of installed heights of the heat sink relative to the PCB. Preferably, the spring fingers terminate with a concave tip that is less susceptible to sliding off the conductive pads.

Abstract: A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material having an opening formed at its base through which the heat sink makes thermal contact with an electronic module mounted on the PCB. The base makes electrical contact with a peripheral surface of the heat sink, and multiple-jointed spring fingers extend from the base to make electrical contact with conductive pads on the PCB. During compression, the movement of each spring finger's tip is substantially limited to the z-axis. Accordingly, the final installed location of the tip can be precisely controlled even when the grounding spring must accommodate a wide variety of installed heights of the heat sink relative to the PCB. Preferably, the spring fingers terminate with a concave tip that is less susceptible to sliding off the conductive pads.

Abstract: A data receiver circuit in a receiving chip provides the capability to characterize an interface, which includes one or more inter-chip communication lines, between a transmitting chip and the receiving chip by transmitting the data across a primary data path and a secondary data path, latching the data in the secondary data path using a clock signal that is skewed relative to a clock signal used to latch the primary data path, comparing the data latched from the primary and secondary data paths, and recording errors. Because the primary data path is not impacted by the test cycle, the test cycle may be run while data associated with applications running on the system are transmitted across the inter-chip communication lines.

Abstract: A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

Abstract: An electronic equipment of the present invention includes housings and, a substrate, electronic components mounted on the substrate, a heatsink which is connected to the electronic component, connection means for connecting the heatsink to the housing depending on a temperature in the housing and for forming a heat conduction path from the electronic component to the housing, and a fan for flowing cooling air into the housing. The substrate, the electronic component, the heatsink, the connection means, and the fan are arranged in the housing. Depending on the temperature, the connection means promotes heat transfer from the heatsink to the housing, which has a large radiation area, in addition to a cooling (radiation) operation using the fan. As a result, the cooling of the electronic component inside the housing is promoted during operation.

Abstract: A chip module assembly includes a CO2 getter exposed through a gas-permeable membrane to a chip cavity of a chip module. One or more chips is/are enclosed within the cavity. The CO2 getter comprises a liquid composition including 1,8-diaza-bicyclo-[5,4,0]-undec-7-ene (DBU) in a solvent that includes an alcohol, preferably, 1-hexanol. In one embodiment, a sheet of gas-permeable membrane is heat-welded to form a pillow-shaped bag in which the liquid composition is sealed. The pillow-shaped bag containing the liquid composition is preferably disposed in a recess of a heat sink and exposed to the cavity through a passage between the recess and the cavity. The CO2 getter can remove a relatively large amount of carbon dioxide from the cavity, and thus effectively prevents solder joint corrosion. For example, based on the formula weights and densities of the DBU and 1-hexanol, 200 g of the liquid composition can remove over 34 g of carbon dioxide.

Abstract: A self-cleaning colloidal slurry and process for finishing a surface of a glass, ceramic, glass-ceramic, metal or alloy substrate for use in a data storage device, for example. The slurry comprises a carrying fluid, colloidal particles, etchant, and a surfactant adsorbed and/or precipitated onto a surface of the colloidal particles and/or substrate. The surfactant has a hydrophobic section that forms a steric hindrance barrier and substantially prevents contaminates, including colloidal particles, from bonding to the substrate surface. The slurry is applied to the surface of the substrate while a pad mechanically rubs the surface. Subsequent cleaning with standard soap solutions removes substantially all remaining contamination from the substrate surface. In an exemplary embodiment, the slurry is used to superfinish a glass disk substrate to a surface roughness of less than 2 ?, with substantially no surface contamination as seen by atomic force microscopy (AFM) after standard soap cleaning steps.