Abstract: The invention is a die attach adhesive composition comprising a homogeneous blend of an organopolysiloxane-bridged bisbenzocyclobutene monomer, an organosilane adhesion aid, and a finely divided electrically conductive metal. The composition is easy to apply, exhibits good adhesive strength and thermal stability at high temperatures, and does not require solvents, initiators, or curing agents. Weight loss on cure is minimal.
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