Abstract: A gang bus apparatus for rigidly coupling plug receptacles within a receptacle enclosure. In accordance with one embodiment of the present invention, a gang bus apparatus includes at least two discrete plug receptacle modules. Each of the plug receptacle modules includes a front surface disposed substantially co-planar with an opening of a module enclosure, the front surface including electromechanical plug reception means for mating with an electrical plug. Each of the plug receptacle modules further includes an opposing rear surface having at least one electromechanical contact point. A rigid, substantially flat conductive bar is disposed along the rear surfaces of the at least two plug receptacles with the conductive bar coupled to each of the electromechanical contact points to simultaneously provide a rigid structural connection between the plug receptacles and provide a common electrical node between the electromechanical contact points.