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Patents Represented by Attorney Mattingly, Stanger, Malur & Brundidige, P.C.

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Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus

Patent number: 7095623

Abstract: A multilayer circuit board having a high level of reliability in terms of electric connection against temperature changes caused by the actual operation of electronic equipment, a manufacturing process, a substrate for multilayer circuitry, and an electronic apparatus.

Type: Grant

Filed: May 27, 2003

Date of Patent: August 22, 2006

Assignee: Hitachi, Ltd.

Inventors: Tokihito Suwa, Haruo Akahoshi, Shingo Kumamoto