Abstract: A method and apparatus for performing hypothermia of a selected organ without significant effect on surrounding organs or other tissues. A flexible coaxial catheter is inserted through the vascular system of a patient to place the distal tip of the catheter in an artery feeding the selected organ. A chilled perfluorocarbon fluid is pumped through an insulated inner supply conduit of the catheter to cool a flexible bellows shaped heat transfer element in the distal tip of the catheter. The heat transfer bellows cools the blood flowing through the artery, to cool the selected organ, distal to the tip of the catheter.

Abstract: A trench DMOS transistor structure having a low resistance path to a drain contact located on an upper surface and methods of making the same.

Abstract: Many conventional pharmaceutical articles contain seemingly inert components that come into contact with a pharmaceutically active material during use, which contact substantially reduces the pharmaceutical effectiveness of the pharmaceutically active material. The invention described herein concerns various modifications to these incompatible components, which are effective to diminish the reduction in pharmaceutical effectiveness.

Abstract: Electronic Music Distribution (EMD), wherein music stored as digital files is downloadable by end users from retail computer databases or from Peer to Peer “file sharing” databases such as Napster, has developed rapidly in the recent past as an alternative to the traditional distribution channels for recorded music. While EMD holds great promise as a distribution vehicle, certain limitations exist with regard to the capability of existing distribution models to classify or characterize the audio quality of the files available for download. This limitation is particularly acute in the Peer-to-Peer context where the downloadable database consists of files from a multiplicity of sources. The present invention utilizes an objective measure of audio quality that is, in one embodiment, presented as part of a response to a user or subscriber search query.

Abstract: A method is provided for forming a power semiconductor device. The method begins by providing a substrate of a first or second conductivity type and then forming a voltage sustaining region on the substrate. The voltage sustaining region is formed by depositing an epitaxial layer of a first conductivity type on the substrate and forming at least one trench in the epitaxial layer. A first layer of polysilicon having a second dopant of the second conductivity type is deposited in the trench. The second dopant is diffused to form a doped epitaxial region adjacent to the trench and in the epitaxial layer. A second layer of polysilicon having a first dopant of the first conductivity type is subsequently deposited in the trench. The first and second dopants respectively located in the second and first layers of polysilicon are interdiffused to achieve electrical compensation in the first and second layers of polysilicon.

Abstract: To reduce power consumption of a communications interface between a network and a processor, a method for controlling the interface monitors data traffic from sides of the interface. Upon detecting a predetermined period of no data traffic on both sides, the method disables an auto-negotiation mode of the interface and forces the interface to operate at its lowest speed. Prior to changing speed, the method may briefly remove a link signal or electrically isolate the network and the network interface to allow a peer to adapt to a new speed. When in the low speed mode, the method monitors data on both the processor side and the network side. Upon detecting a predetermined and configurable amount of data, the method enables the auto-negotiate mode. Prior to increasing the speed, the method may briefly remove a link signal to allow a peer to adapt to the new speed. Hysteresis may be included to prevent a speed change if a predetermined period has not occurred since a last speed change.

Abstract: The present invention discloses a power semiconductor device manufactured using a chip-size package. The power semiconductor device includes a die having a first surface and a second surface opposite to the first surface; at least one lead frame, each of the at least one lead frames having a first terminal and a second terminal, the first terminal electrically connected to a corresponding terminal of the first surface or a corresponding terminal of the second surface of the die; an electrically conductive plate electrically connected to a corresponding terminal of the second surface of the die; and a packaging material used to encapsulate the die, one terminal of the lead frame and the electrically conductive plate. The second terminal of each lead frame and a surface of the electrically conductive plate opposite to the surface electrically connected to the second surface of the die are exposed to the outside of the packaging material and lie on the same plane.

Abstract: The present invention provides a method and apparatus for rendering an input video stream as a polygon texture. The method provides process steps to receive the input video data in a Mip Map generator, wherein the Mip Map generator converts the video data to Mip Map data and stores the Mip Map data in a first memory storage device; wherein the first memory storage device is located in a V buffer. The method further includes sending a data set from a Z buffer to V buffer and mapping the data set to RGB values at a texel address in the V buffer memory. The data set includes U, V and Z coordinates, Mip Map level and channel identification data. The V buffer includes a V buffer fetch module that receives the data set from the Z buffer and maps to RGB data within V buffer memory.

Abstract: A method for providing a mechanical/electrical interconnection between two circuit boards, and the interconnection components required therefore, include a pin and socket each having a tail portion, a shoulder portion and a head portion. The tail portion of the pin is sized so as to fit into a plated through hole of the first board, the head portion is sized so as to allow an automated device to capture the head portion and to rest on top of the plated through hole when inserted therein, and the shoulder portion is sized in relation to the plated through hole so as to rest inside the plated through hole and to allow a predetermined amount of solder to flow under the head portion and down into the plated through hole, but not as far down as the tail portion, thereby assisting in centering the pin in the through hole.

Abstract: The use of an intravascular cooling element to induce hypothermia in connection with a medical procedure. According to a first aspect of the present, invention, a coronary bypass procedure is conducted in which a patient's blood is oxygenated with the patient's lungs and in which blood is circulated using the patient's heart or using an intracorporeal pump. The procedure preferably comprises: (a) positioning a heat transfer element in a blood vessel of a patient; (b) cooling the body of the patient to less than 35° C., more preferably 32±2° C., using the heat transfer element; and (c) forming a fluid communicating graft between an arterial blood supply and the coronary artery. The body of the patient is preferably heated to about 37° C. using the heat transfer element subsequent to the step of forming the fluid communicating graft.

Abstract: A reverse link modulator modulates the incoming data sequence for the I and Q channels of a wireless device such that the resulting spreading sequence never undergoes a transition through the origin. Consequently, the modulator has a reduced peak-to-average ratio and provides an improved battery life.

Abstract: A method and system for reordering a plurality of DSS data packets stored in a memory is provided that utilizes a memory buffer capable of storing at least one DSS data packet. The last data packet (Pn) is located and moved to the memory buffer. The data packet (Px) that should be located at the location of the last packet (Pn) is moved to fill the space vacated. If the last data packet should be located at the location of Px, then the last but one (Pn−1) packet is located and moved to the memory buffer. The packet (Px′) that should be located at the location of Pn−1 is then moved to the location of Pn−1. The process is repeated until all the data packets are reordered.

Abstract: Novel nitric-oxide releasing lipid molecules are provided which comprise a lipid molecule selected from (a) phosphoglycerides, (b) lipids having a sphingosine base as a backbone, (c) monoacylglyerols, (d) diacylglycerols, (e) glycosylacylglycerols, wherein the lipid molecole is provided with a nitric-oxide contianing group which comprises a (a) a —S—N═O moiety, (b) a —O—N═O moiety, or (c) a moiety. Also provided are methods of forming such nitric oxide releasing lipid molecules. Various pharmaceutical compositions, topical liquids and drug delivery systems comprising the ntric-oxide releasing lipid molecules are also described. Further provided are methods for therapeutically administering nitric oxide to patients, methods for treating or preventing various conditions, methods for promoting wound healing and methods for reducing the cells present in an atherosclerotic lesion which methods utilize the nitric-oxide releasing lipid molecules.

Abstract: A trench DMOS transistor cell is provided that includes a substrate of a first conductivity type and a body region located on the substrate, which has a second conductivity type. At least one trench extends through the body region and the substrate. An insulating layer lines the trench and a conductive electrode is placed in the trench overlying the insulating layer. A source region of the first conductivity type is located in the body region adjacent to the trench. The trench has sidewalls that define a polygon in the plane of the substrate so that adjacent sidewalls contact one another at an angle greater than 90 degrees.

Abstract: The abstract is amended to read, “An inventive method and apparatus is provided by a bidirectional optical 1×2 device formed by a cascade of three optical 2×2 devices. Each 2×2 device is bidirectional where optical signals propagate through the 2×2 device in the forward and backward directions simultaneously. The demultiplexing and multiplexing occur simultaneously to thereby perform bidirectional 1×2 optical demultiplexing and 2×1 optical multiplexing in the 1×2 device.

Abstract: A trench MOSFET transistor device and method of making the same are provided. The trench MOSFET transistor device comprises: (a) a drain region of first conductivity type; (b) a body region of a second conductivity type provided over the drain region, such that the drain region and the body region form a first junction; (c) a source region of the first conductivity type provided over the body region, such that the source region and the body region form a second junction; (d) source metal disposed on an upper surface of the source region; (e) a trench extending through the source region, through the body region and into the drain region; and (f) a gate region comprising (i) an insulating layer, which lines at least a portion of the trench and (ii) a conductive region, which is disposed within the trench adjacent the insulating layer. The body region in this device is separated from the source metal.

Abstract: An endoscope apparatus and method of operating the same. The endoscope apparatus comprises an endoscope portion and a control and display unit. The endoscope portion preferably comprises: (i) a sensor disposed at a distal end of the endoscope portion and providing endoscope data; (ii) one or more electronically controlled actuators (e.g., electroactive polymer actuators) controlling the operation of the endoscope portion based on received control signals; (iii) a first wireless transceiver coupled to the sensor and the one or more electronically controlled actuators, transmitting received endoscope data from the sensor and forwarding received control signals to the one or more electronically controlled actuators; and (iv) a portable power source (e.g., a battery) coupled to the sensor, the first wireless transceiver, and the one or more electronically controller actuators.

Abstract: A Schottky rectifier is provided. The Schottky rectifier comprises: (a) a semiconductor region having first and second opposing faces, with the semiconductor region comprising a cathode region of first conductivity type adjacent the first face and a drift region of the first conductivity type adjacent the second face, and with the drift region having a lower net doping concentration than that of the cathode region; (b) one or more trenches extending from the second face into the semiconductor region and defining one or more mesas within the semiconductor region; (c) an insulating region adjacent the semiconductor region in lower portions of the trench; (d) and an anode electrode that is (i) adjacent to and forms a Schottky rectifying contact with the semiconductor at the second face, (ii) adjacent to and forms a Schottky rectifying contact with the semiconductor region within upper portions of the trench and (iii) adjacent to the insulating region within the lower portions of the trench.

Abstract: A cascaded interleaver includes at least three two-stage Fourier filters. A first of the Fourier filters includes first and second waveguides such that the first waveguide has a longer optical path length than the second waveguide. A second of the Fourier filters includes third and fourth waveguides such that the third waveguide has a longer optical path length than the fourth waveguide. A third of the Fourier filters has fifth and sixth waveguides such that the fifth waveguide has a longer optical path length than the sixth waveguide. The third waveguide has an input coupled to an output of the first waveguide and the fifth waveguide has an input coupled to an output of the second waveguide. At least one of the Fourier filters include at least three couplers alternating with a delay path between adjacent ones of the couplers. A second of the couplers is of an order different from a first and third of the couplers.

Abstract: The present invention is directed to an organic optoelectronic device, such as an OLED device, provided with a vacuum deposited conformal composite coating for protecting the device from environmental elements such as moisture and oxygen. The present invention is also directed to a method for vacuum depositing a conformal composite coating directly onto an organic optoelectronic device, such as an OLED device, on a substrate. According to one embodiment, the invention provides a protected OLED device comprising a substrate; an active region positioned on said substrate; a first protective layer disposed over the active region; and a second protective layer disposed over the first protective layer, wherein said second protective layer comprises multiple sub-layers that further comprise an alternating series of two or more first polymeric sub-layers and two or more first high density sub-layers.