Abstract: A pixel of a complementary metal oxide semiconductor (CMOS) image sensor includes a plurality of photodiodes for sensing light to thereby generate photoelectric charges in different regions; a plurality of transfer transistors for transferring photoelectric charges of corresponding photodiodes in response to a first control signal; a floating diffusion region for receiving photoelectric charges transferred by the plurality of transfer transistors; a rest transistor connected between a power supply voltage and the floating diffusion region for resetting the floating diffusion region by controlling a voltage loaded on the floating diffusion region in response to a second control signal; a drive transistor connected between the power supply voltage and the floating diffusion region to serve as a source follower buffer amplifier; and a select transistor connected between the drive transistor and a pixel output terminal for performing an addressing operation in response to a third control signal.

Abstract: A packaging assembly having an open design for displaying a product is provided. The packaging assembly is configured for storage and display in high density arrays of packaging assemblies, such as storage in pallets, and is configured to display visual information to a user from any perspective, even when the packaging assembly is packed in high density arrays of packaging assemblies. The packaging assembly includes an inner portion designed to contain a product and a housing designed to house the inner portion, wherein the inner portion includes a substantially transparent cover that facilitates display of the product. The packaging assembly includes an outer portion having a three dimensional window box frame, wherein portions of the window box frame are configured to couple to flanges provided on the inner portion.