Abstract: The present invention provides variable density fluid compositions and methods for using such compositions in a subterranean formation. One exemplary embodiment of the variable density fluid compositions of the present invention comprises a variable density fluid comprising: a base fluid, and a portion of variable pressure weighting material particles.

Abstract: A method for surface modification of non-dispersible metal nanoparticles comprises mixing metal nanoparticles having an amorphous carbon layer on the surface with an alcohol or thiol solvent, mixing a capping molecule having a carboxylic head group in the mixed solution, and separating the metal nanoparticles from the mixed solution and the metal nanoparticles for inkjet printing thus modified.

Abstract: Wellbore treatment kits are provide that include a polymeric solution for placement in a wellbore that penetrates a subterranean formation and an activator for causing a polymer to precipitate out of the polymeric solution when it contacts the polymeric solution, wherein the resulting precipitate is capable of at least partially blocking a flow of a wellbore servicing fluid into the subterranean formation. The wellbore servicing fluid may be, for example, a drilling fluid, a cement composition, a workover fluid, or combinations thereof. The polymeric solution may comprise, for example, a poly vinyl pyrrolidone aqueous solution, and the activator may comprise, for example, a formate brine. When desirable, the precipitate may be easily and quickly removed from the subterranean formation by dissolving it in fresh water.

Abstract: The method of manufacturing a semiconductor device comprising: forming a wiring pattern on a substrate; forming a thermosetting resin layer on the substrate; aligning and adhering a semiconductor chip to the wiring pattern for electric connection via the thermosetting resin layer; and press-bonding an electrode of the chip onto the wiring pattern while the chip is being heated. During the press-bonding step, the substrate is cooled. By the cooling, the amount of thermal expansion of the substrate is suppressed and therefore comes closer to the thermal expansion of the chip. By mounting the chip on the substrate through the steps described above, the reliability of moisture resistance of the semiconductor device is greatly improved.