Patents Represented by Attorney, Agent or Law Firm McDermott Will & Emory
  • Preconditioning polishing pads for chemical-mechanical polishing
    Patent number: 6300247
    Abstract: A polishing pad for CMP is rapidly preconditioned before actual use by impinging a stream of particles on the polishing surface. Embodiments of the present invention include linearly traversing an impinging jet stream of unagglomerated ceramic particles, e.g., silicon dioxide particles having a particle size of about 5 to about 50 nm, across the polishing surface of a rotating polishing pad to effect preconditioning in less than about 5 minutes.
    Type: Grant
    Filed: March 29, 1999
    Date of Patent: October 9, 2001
    Assignee: Applied Materials, Inc.
    Inventor: Golpalakrishna B. Prabhu