Abstract: Structures and methods are disclosed to produce mechanical strength in Micro Electro Mechanical Systems by increasing the moment of inertia of some of the composing elements. In one aspect, a thermal sensor with improved mechanical strength, thermal insulation and time constant is achieved. Moreover, the current method and apparatus is advantageous in terms of process time and process cost, particularly in the area of lithographic patterning.

Abstract: Methods and apparatuses are provided for modeling the compensation error and simulating registration error of a multilayer printed circuit board. Experiments are conducted in order to model compensation error which factor one or a combination of the following: the dielectric layer, the position of the core in the stack, the circuit configuration, the assembly of the printed circuit board, and the interaction between the core and the dielectric layer. The registration simulator combines the sources of registration error in an interdependent manner so as to model overall registration error over the panel surface.