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Patents Represented by Attorney McGinn IB Law Group, PLLC

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Heat sink, an electronic component package, and a method of manufacturing a heat sink

Patent number: 7755895

Abstract: A heat sink for an electronic component includes a structure that is bendable.

Type: Grant

Filed: February 17, 2006

Date of Patent: July 13, 2010

Assignee: NEC Corporation

Inventor: Hironobu Ikeda