Patents Represented by Attorney McGinn Intelletual Property Law Group, PLLC

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  • Method and apparatus for manufacturing electronic integrated circuit chip
    Patent number: 7964444
    Abstract: A method (and apparatus) of assembling a die on an electronic substrate, includes processing an assembly including a substrate and a die, and during the processing, introducing a pre-stress to the assembly during a cure process.
    Type: Grant
    Filed: February 15, 2007
    Date of Patent: June 21, 2011
    Assignee: International Business Machines Corporation
    Inventor: Sri M. Sri-Jayantha