Abstract: Provided is a method of connecting conductive traces on one substrate to conductive traces on another substrate using an adhesive containing conductive particles and the resulting article.
Type:
Grant
Filed:
April 11, 2006
Date of Patent:
February 15, 2011
Assignee:
3M Innovative Properties Company
Inventors:
Kohichiro Kawate, Andrew C. Lottes, James G. Vana, Jr., Barbara L. Birrell, Alexander W. Barr
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