Patents Represented by Attorney Mendelsohn, Drucker & Asociates, P.C.

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    Patent number: 7671436
    Abstract: Assemblies involving integrated circuit dies (e.g. packaged integrated circuits) and packaged dies electrically connected to circuit boards at times mechanically fail at conducting pads used for electrical interconnection. Such failure is mitigated by underlying appropriate pads with a compliant region having specific characteristics.
    Type: Grant
    Filed: May 2, 2008
    Date of Patent: March 2, 2010
    Assignee: Agere Systems Inc.
    Inventors: Ahmed Nur Amin, Mark Adam Bachman, David Lee Crouthamel, John William Osenbach, Brian Thomas Vaccaro