Abstract: The present disclosure describes an insulated electrical contact pin for use in making wiring changes in an interconnection medium such as a printed circuit board or backplane. More specifically, the present pin replaces the original compliant press-fit type pin mounted in a plated-through hole on the board. The pin is formed in two sections--one section having a threaded extremity, and the other, a tapped bore to receive the former. The pin is mounted in a plated-through hole on the printed wiring board by screwing the two sections together. Portions of the pin sections are electrically insulated from the wiring traces situated on or below the board surface. The present contact pin is versatile, easy to install and tolerance-free with respect to the dimensions of the plated-through hole in which it is mounted.

Abstract: A cooling system for integrated circuit packaging of the conventional dual-in-line (DIP) type including a carrier heat sink plate which form web sections which engage the bodies of the DIP held side-by-side thereon. The plate is thermally and mechanically connected by means of a clamping device to a cooling frame in which a serpentine tubing carries coolant throughout spaced apart sections thereof, so that the heat generated by the DIP's is carried away by the heat sink plate into the frame sections where the coolant circulate. The DIP pins are electrically connected to a printed circuit board and to relatively flat flexible ribbon type printed circuit type cable the latter being clamped at each end into a standard connector which itself is clamped to an island printed circuit board having conductors thereon for connecting the DIP's to other electronic devices. Multiplicity of these DIP's so mounted in the cooling frame may be housed in the same console or housing along with other DIP islands as desired.