Abstract: A treatment system for treating objects (e.g., medical instruments) with ozone gas. The ozone treatment system includes a treatment tank wherein the objects are exposed to ozone. In a preferred embodiment, the ozone is generated within the treatment tank by exposing an oxygen-containing gas to ultraviolet radiation produced by a laser.

Abstract: A portable cart for use in a washing chamber for organizing and supporting articles to be washed. The cart is comprised of a generally rectangular, open frame structure comprised of a plurality of elongated structural members. A plurality of the structural members have apertures formed therein. Two planar panels are attached to the frame. The panels are spaced apart and have a plurality of apertures formed therethrough. A plurality of elongated rods are attached to and extend between the panels and are attached to the apertures. The rods define article support areas within the frame structure. One or more support elements are mounted through the apertures in the structural members or the panels. The support elements are dimensioned to support articles. Coasters at one end of the frame member allow rolling movement of the frame member.

Abstract: A method of forming a laminate used in the manufacture of printed circuit boards, comprising the steps of applying a layer of chromium having a thickness from about 30 grams per square meter to about 160 grams per square meter to each side of a steel substrate having a thickness from about 0.10 mm to about 0.20 mm. Applying a layer of copper having a thickness from about 2 &mgr;m to about 70 &mgr;m to each of the chromium layers. Positioning the steel substrate between two dielectric layers with adhesive disposed between the copper layers and the dielectric layers. Applying heat and pressure to the layers to bond the copper layers to the dielectric layers. Separating the steel substrate from the copper layers, and discarding the steel substrate.

Abstract: An apparatus for producing metal foil, comprising a drum cathode having an outer plating surface. The drum cathode is partially immersed to a set level in an electrolyte bath and is rotatable in a fixed direction about a generally horizontal axis. A main anode assembly having a main anode is immersed in the electrolyte bath, the main anode having a semi-cylindrical curved anode surface facing the drum cathode. The main anode is dimensioned to be spaced from the plating surface of the drum cathode so as to define a generally uniform gap therebetween. An energy source is connected to the main anode for energizing the main anode. A chamber containing an electrolyte solution is disposed above the electrolyte bath and adjacent the cathode drum where the cathode drum exits the electrolyte bath. A treatment anode is immersed in the electrolyte solution in the chamber adjacent the drum cathode. An energy source is connected to the treatment anode for energizing the treatment anode.

Abstract: A sheet stacking device comprised of a sheet support bed having a first end and a second end. The sheet support bed is comprised of a plurality of side-by-side rollers, each of the rollers being freely rotatable about an associated roller axis. A drive assembly moves the sheet support bed in a predetermined direction along a closed path, the path having a horizontal upper run and a horizontal lower run, and is dimensioned such that a space exists between the first end and the second end of the sheet support bed as the sheet support bed moves along the path. A roller control assembly for selectively and sequentially controlling rotation of select ones of the rollers at select intervals during a stacking operation.

Abstract: A component for use in manufacturing printed circuits that in a finished printed circuit constitutes a functional element. The component is comprised of a film substrate formed of a first polymeric material having a first side and a second side. At least one layer of a tiecoat metal is applied to the first side of the film substrate. At least one layer of copper on the at least one layer of a tiecoat metal, the layer of copper having an essentially uncontaminated exposed surface facing away from the at least one layer of tiecoat metal. A plurality of spaced apart, adhesion promoting areas of a tiecoat metal are provided on the second side of the film substrate defining regions of exposed polymeric material on the second side of the film substrate.

Abstract: In one embodiment, the present invention relates to a method of increasing resin dust resistance of metal foil comprising contacting the metal foil with an inert silane, titanate or zirconate compound to form a resin dust resistant film having a thickness from about 0.001 microns to about 1 micron on a surface of the metal foil. In another embodiment, the present invention relates to a method of treating metal foil comprising contacting a first side of the metal foil with a hydrocarbylsilane solution to form a resin dust resistant film on a surface of the metal foil, the hydrocarbylsilane solution comprising from about 0.01% to about 10% v/v of a hydrocarbylsilane; and laminating a second side of the metal foil to a prepreg.

Abstract: A component for use in manufacturing printed circuits, comprising: a laminate that in a finished printed circuit constitutes a functional element, the laminate comprised of: a film substrate formed of a first polymeric material; at least one layer of a flash metal applied to a first side of the film substrate, and at least one layer of copper on the at least one layer of a flash metal, the layer of copper having an essentially uncontaminated exposed surface facing away from the at least one layer of flash metal; and a planar layer of metal that constitutes a discardable element, the layer of metal having an essentially uncontaminated surface that is inert to copper, the laminate being attached to the layer of metal at its borders to define a substantially uncontaminated central zone inwardly of the edges of the sheet that is unjoined at the interfaces.

Abstract: A component for use in forming a multi-layer printed circuit comprised of a film substrate formed of a first polymeric material. At least one layer of a flash metal is applied to a first side of the film substrate, and at least one layer of copper is applied on the layer of flash metal. A discrete area of a resistive material is disposed on a second side of the film substrate.

Abstract: A laminate for use as a surface laminate in a multi-layer printed circuit board. The laminate is comprised of a film substrate formed of a first polymeric material. At least one layer of a flash metal is applied to a first side of the film substrate. At least one layer of copper is disposed on the layer of flash metal. An adhesive layer formed of a second polymeric material has a first surface that is attached to a second side of the film substrate.

Abstract: This invention relates to a metal body having at least one vapor-deposited treatment layer overlying and adhered to at least one side of the metal body, and a layer of adhesion-promoting material overlying and adhered to at least one treatment layer, provided that when two treatment layers are deposited on one side of the body and the first layer is vapor-deposited zinc, the second layer is not vapor-deposited silica or alumina, said adhesion-promoting material being suitable for enhancing adhesion between said body and another substrate. The invention also relates to laminates comprising metal foils and at least one vapor-deposited treatment layer overlying and adhered to at least one side of the metal foil; a layer of adhesion-promoting material overlying and adhered to at least one vapor-deposited treatment layer; and a layer of an electrically non-conductive material overlying and adhered to the adhesion-promoting layer.

Abstract: A component for use in manufacturing articles, such as printed circuit boards, comprising a laminate constructed of a sheet of copper foil that, in a finished circuit board, constitutes a functional element, and a sheet of carbon steel having a layer of an inert metal thereon, the sheet of carbon steel constituting a discardable element. One surface of the copper sheet and the surface of the inert metal layer on the carbon steel sheet are essentially uncontaminated and engageable with each other at interfaces. The copper sheet is attached to the inert metal layer of the carbon steel sheet at their borders and defines substantially uncontaminated central zones inwardly of the edges of the sheets that are unjoined at the interfaces.

Abstract: Method of forming a flexible circuit laminate for use in the production of flexible circuits, comprising the steps of electrodepositing a continuous layer of copper on a first side of a generally continuous strip of polyimide having a layer of metal on the first side, modifying a second side of the polyimide strip to increase the surface energy thereof, applying a preformed adhesive film on the second side of the generally continuous strip of polyimide, the adhesive strip being formed of a substantially uncured polymeric material, and curing the adhesive film wherein at least the outmost layer of the adhesive film is only partially cured.

Abstract: An electrolytic cell comprised of a tank for holding electrolytic solution, and a drum rotatable about a horizontal axis having a non-conductive cylindrical outer surface disposed within the tank, and a plurality of elongated, like anodes arranged about the outer surface of the drum. The anodes together form a generally continuous cylindrical surface spaced from, and generally conforming to, the outer surface of the drum. Each of the anodes has at least one end projecting through the tank. A plurality of power sources is provided together with connection means for connecting groups of one or more of the projecting ends of the anodes to each power source.

Abstract: In one embodiment, the present invention relates to a flexible laminate, comprising a first flexible polymeric film; a copper layer having a microcracking prevention layer on at least one side the microcracking prevention layer sufficient to prevent microcracks in a copper layer having a thickness of up to about 18 &mgr;m during at least 50,000,000 bending cycles and/or a copper layer having a thickness of up to about 35 &mgr;m during at least 20,000,000 bending cycles of the flexible laminate; and a second flexible polymeric film.

Abstract: An electrodeposition cell for electrodepositing metal onto a surface of a rotating drum that is partially immersed in an electrolytic solution. The cell includes an anode comprised of a main anode body portion and an anode extension portion. The main anode body portion has an arcuate main anode body surface having a radius of curvature slightly larger than the radius of curvature of the drum. The main anode body portion is totally immersed in the electrolytic solution adjacent the drum wherein a generally uniform gap is formed therebetween. The anode extension portion has an anode extension surface facing the drum and at least one opening extending therethrough. The anode extension portion is disposed within the electrolytic solution wherein a portion thereof extends above the electrolytic solution and the electrolytic solution can flow through the opening.

Abstract: This invention relates to an improved adhesiveless flexible laminate, comprising: a polymer film having a plasma treated surface; a nickel tie coat layer comprising nickel or a nickel alloy adhered to said plasma treated surface; and a copper seed coat layer adhered to the nickel layer. In one embodiment, another layer of copper is adhered to the copper seed coat layer. This invention also relates to a process for making the foregoing adhesiveless flexible laminate, the process comprising the steps of: (A) contacting at least one side of a polymeric film with a plasma comprising ionized oxygen produced from a non-metallizing cathode to provide a plasma treated surface; (B) depositing a tie coat of nickel or nickel alloy on said plasma treated surface; and (C) depositing a seed coat layer of copper on said nickel tie coat layer. The process also includes the optional step of (D) depositing another layer of copper over the copper seed coat layer from step (C).

Abstract: This invention relates to a process for applying a stabilization layer to at least one side of copper foil comprising contacting said side of said copper foil with an electrolyte solution comprising zinc ions, chromium ions and at least one hydrogen inhibitor. This invention also relates to copper foils treated by the foregoing process, and to laminates comprising a dielectric substrate and copper foil treated by the foregoing process adhered to said dielectric substrate.

Abstract: Method of forming a flexible circuit laminate for use in the production of flexible circuits, comprising the steps of electrodepositing a continuous layer of copper on a first side of a generally continuous strip of polyimide having a layer of metal on the first side, modifying a second side of the polyimide strip to increase the surface energy thereof, applying a preformed adhesive film on the second side of the generally continuous strip of polyimide, the adhesive strip being formed of a substantially uncured polymeric material, and curing the adhesive film wherein at least the outmost layer of the adhesive film is only partially cured.

Abstract: This invention relates to a treated copper foil, comprising: a copper foil with a layer of zinc oxide adhered to the base surface of at least on side of said copper foil, said layer of zinc oxide having a thickness of about 3 .ANG. to about 80 .ANG.; and a layer of a trivalent chromium oxide adhered to said layer of zinc oxide. In one embodiment, the foil has a layer of a silane coupling agent adhered to the layer of trivalent chromium oxide. The invention also relates to a process for applying the layer of zinc oxide and the layer of trivalent chromium oxide to the copper foil. The invention also relates to laminates comprising a dielectric substrate and the foregoing copper foil adhered to the substrate. In one embodiment, the dielectric substrate is comprised of an epoxy resin made with a curing agent that is other than an amine curing agent.