Abstract: An electronic component has an insert member embedded in a resin portion by an insert molding method, with a part of the insert member exposed at an outer surface of the resin portion. At least a part of the exposed portion of the insert member is depressed relative to the outer surface of the resin portion.
Type:
Grant
Filed:
March 23, 1999
Date of Patent:
March 9, 2004
Assignee:
Japan Aviation Electronic Industry, Limited