Patents Represented by Attorney, Agent or Law Firm Michael Best & Fried Friedrich LLP
  • Patent number: 6702624
    Abstract: An electronic component has an insert member embedded in a resin portion by an insert molding method, with a part of the insert member exposed at an outer surface of the resin portion. At least a part of the exposed portion of the insert member is depressed relative to the outer surface of the resin portion.
    Type: Grant
    Filed: March 23, 1999
    Date of Patent: March 9, 2004
    Assignee: Japan Aviation Electronic Industry, Limited
    Inventors: Hiroshi Akimoto, Katsumi Arai, Katsuma Ushijima, Takahiro Abe