Abstract: A robust printhead is disclosed comprising a substrate, an ink flow channel formed in the substrate, a beveled die having disposed heater resistors and which is inserted into the substrate, a TAB circuit used to electrically couple the beveled die to the substrate, and an encapsulated upper surface. The encapsulant is disposed at least over the electrical coupling between the beveled die and the interconnect.
Type:
Grant
Filed:
October 29, 1999
Date of Patent:
February 13, 2001
Assignee:
Hewlett-Packard Company
Inventors:
Marvin Glenn Wong, Melissa D. Boyd, Timothy E. Beerling