Patents Represented by Attorney Michael Hardaway
  • Patent number: 7989959
    Abstract: A stacked-die integrated circuit and a method of fabricating same. The stacked-die integrated circuit has circuitry formed in the first surface of a mother die, a plurality of through-die vias with at least one through-die via providing electrical connection between the circuitry of the mother die and the second surface and a plurality of contact pads formed in the second surface of the semiconductor die for mounting a daughter die wherein some of the contact pads are electrically isolated dummy pads.
    Type: Grant
    Filed: January 29, 2009
    Date of Patent: August 2, 2011
    Assignee: Xilinx, Inc.
    Inventor: Arifur Rahman