Patents Represented by Attorney, Agent or Law Firm Michael K. Shrehot
  • Polymer-embedded solder bumps for reliable plastic package attachment
    Patent number: 6696644
    Abstract: A plastic package for use in semiconductor devices, which has a plurality of metallic terminals exposed on a package surface and a metallic bump attached to each of said terminals. The bumps are made of reflowable metal and have approximately uniform height. An adherent layer of polymer material covers the package surface and surrounds each of the bumps to form a solid meniscus. The layer has a thickness between a quarter and one half of the bump height. An analogous methodology applies to plastic assembly boards.
    Type: Grant
    Filed: August 8, 2002
    Date of Patent: February 24, 2004
    Assignee: Texas Instruments Incorporated
    Inventors: Tz-Cheng Chiu, Manjula N. Variyam