Abstract: A method of waveform generation using a VLSI digital tester unit without an arbitrary waveform generator. A software application produces a series of vectors to drive a digital tester unit from a set of datapoints which defines a waveform needed in the test program. The set of datapoints can be generated in a test simulator such as SPICE or can be generated by digitizing the arbitrary waveform needed in a test program. The vectors describe the number of resistors of a pseudo arbitrary waveform generator (PAWG) circuit to be driven high in order to reproduce the desired waveform for input into the device under test. The software also determines the resolution, e.g., 5 ns, of the waveform.

Abstract: Improve the productivity and cost for the manufacturing of a semiconductor device referred to as a wafer level CSP. The manufacturing method for a semiconductor device related to this invention contains each of the processes that form a wiring (18) for the purpose of electrically connecting each electrode pad (10a) and external connecting terminals on top of a wafer (10) on which semiconductor elements are formed, connect conductive balls that are preformed by a separate process on top of this, and next, cover the above-mentioned wafer with a resin (32) such that the upper portion of the conductive supporting posts (30) are exposed. In a later process, solder balls (34) are arranged as external connecting terminals on the upper portion of the conductive supporting posts, and in the final process, semiconductor elements are formed by dicing the above-mentioned wafer along the boundary lines of the above-mentioned semiconductor elements.