Abstract: A connect and disconnect assembly for connecting and disconnecting a laser diode having leads to a printed circuit board (PCB). The assembly includes a heatsink having a base plate portion and fins extending from and integral with the base plate portion. The heatsink further includes spacer sleeves extending from a side of the base plate portion opposing the fins. The heatsink connects to the printed circuit board by providing mount screws through the heatsink and spacer sleeves which are received in mount holes formed in the PCB. The laser diode connects to the base plate portion of the heatsink. Laser support blocks connect with the heatsink and support opposing sides of the laser diode. Each laser support block is provided with a dielectric gasket. When the heatsink is mounted onto the PCB, the laser diode leads are forced against corresponding pads provided on the PCB for electrically connecting the laser diode to the PCB.