Abstract: A heat transfer system is provided. The system includes a heat sink disposed proximate a first circuit. An air mover is adapted to provide airflow, and at least a portion of the airflow can flow through the heat sink along a flow path having a path length. A first portion of the airflow flows along the entire path length through the heat sink. A remaining portion of the airflow exits the heat sink prior to flowing the entire path length.
Type:
Grant
Filed:
July 31, 2009
Date of Patent:
April 26, 2011
Assignee:
Hewlett-Packard Development Company, L.P.
Inventors:
Andrew L. Wiltzius, Robert Lee Crane, Jonathan Shea Robinson, River Yao