Abstract: The invention relates to a method for producing low cost hermetic Integrated Module Assembly (IMA) packaging, where an aluminum coating (24) is deposited on a poly-tetrafluoral-ethaline substrate (20), the aluminum coating (24) is selectively etched to form a waveguide window (26) and the substrate (20) is selectively treated over the waveguide window (26) to produce a non-conductive hermetic seal. The substrate (20) is then joined to a metal carrier (28) containing the waveguide (30). As a result of using selectively treated low cost substrates to produce hermetic seals, more expensive substrates are not required to form hermetic seals over substrate to waveguide interconnections.

Abstract: A local telecommunications network is provided for satellite based telecommunications. The network 10 includes multiple handsets 18-22, 50 and 54 which communicate directly with ground stations 14 and 16. The ground stations communicate with an overhead satellite 12 through a satellite telecommunications uplink. The ground stations include a router for determining whether outgoing calls are directed to a destination handset located within or outside a predefined local geographic cell 30 and 32 for the corresponding ground station 14 and 16. If the destination handset is located outside the local cell of the originating handset, the ground station passes the call to the overhead satellite 12 to establish a satellite telecommunications link. However, if the destination handset 50 is located within the same local cell 32 as the originating handset 22, then the router 16 establishes a direct link between the handsets 22 and 50 without establishing a satellite telecommunications link 26.

Abstract: A piezoelectric actuator/sensor package and corresponding method for its fabrication, and a method of embedding a ceramic actuator/sensor in a laminated structural member, such as a graphite-epoxy laminate. A ceramic actuator/sensor, with lead wires first bonded to it, is encapsulated in a non-conductive fiber composite material, such as fiberglass cloth and epoxy, to form a package that is precured at a suitable temperature, typically room temperature. Encapsulation provides electrical insulation, good strain coupling, protection from mechanical damage, and reduction in thermal stresses, since the coefficient of thermal expansion of the encapsulating material is selected to be between those of the ceramic and the graphite-epoxy laminate. Graphite fibers may be added to the package to enhance voltage-strain performance. The package is embedded in the structural laminate and the composite structure is cured in a manner that minimizes thermally-induced stresses.