Abstract: Scrap silicon from which a profit can be obtained taking into consideration the purchase price and refining cost of scrap silicon and the expected sale price of silicon products is selectively recovered, the recovered scrap silicon is refined, and silicon which can be sold as a silicon product is manufactured.

Abstract: A manipulator for use with a lift truck includes a guide assembly mountable on a mast of a lift truck, a carriage assembly supported for movement along the guide assembly, and an arm assembly mounted on the carriage assembly for supporting a lift truck attachment such as a clamping apparatus. The arm assembly may include two arms pivotable with respect to each other about a substantially vertical axis. The manipulator can move a load in a widthwise direction of a lift truck and between opposite widthwise sides of a lift truck.

Abstract: In a refining method for boron-containing silicon, boron-containing silicon is irradiated with an electron beam in a vacuum vessel to melt the boron-containing silicon. A boron compound-forming substance is introduced into the vacuum vessel, and boron contained in the molten silicon is formed into a boron compound. After at least a portion of the boron compound has vaporized, irradiation with the electron beam is stopped. The high-purity molten silicon can then be solidified.

Abstract: A crucible apparatus includes a hollow crucible body which is open at its upper and lower ends and a bottom plate which is formed separately from the crucible body and can close off the lower end of the crucible body. A space for receiving a molten material is formed by placing the crucible body atop the bottom plate. When molten material received in the space has solidified, the crucible body is raised off the bottom plate, and solidified material is pushed out of one end of the crucible body and removed from the crucible body.

Abstract: A fixing liquid for properly and economically suppressing or preventing dispersion of dust (asbestos dust) generated through weathering or demolition of a sprayed-on material containing asbestos is prepared by homogeneously incorporating a surfactant and a thickener (e.g., CMC) into a solution of a polysaccharide (e.g., gum arabic). When an appropriate amount of the fixing liquid is sprayed onto a sprayed-on material containing asbestos, dust due to weathering of the sprayed-on material is wetted and retained, and dispersion of dust generated during demolition of the material is suppressed or prevented. Even after drying of the fixing liquid, the viscosity of the liquid is restored by re-wetting with water, and dispersion of dust generated during demolition of the thus-treated material is suppressed or prevented. Since the thickener has an increased volume in the presence of water, the thus-treated material is readily removed.

Abstract: A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded, rolled, and punched to form a pellet or a washer, for example.

Abstract: A Sn—Ag—Cu based lead-free solder ball which does not undergo yellowing of its surface when formed into a solder bump on an electrode of an electronic part such as a BGA package. The solder ball has excellent wettability and does not form voids at the time of soldering, even when it has a minute diameter such as 0.04-0.5 mm. It has a composition comprising 1.0-4.0 mass % of Ag, 0.05-2.0 mass % of Cu, 0.0005-0.005 mass % of P, and a remainder of Sn.

Abstract: A method and apparatus for refining silicon which can remove impurity elements such as phosphorus and antimony as well as impurity elements such as boron and carbon using an electron beam in the same vacuum chamber are provided. Silicon is irradiated and melted with an electron beam in a low vacuum inside a vacuum vessel, a compound-forming substance such as H2O which reacts with boron or the like in the molten silicon and forms a vaporizable oxide is introduced into the vacuum chamber, and impurity elements such as boron having a low vapor pressure in a vacuum are evaporated from the molten silicon as part of the vaporizable compound. Silicon in the vacuum vessel is then irradiated with an electron beam in a high vacuum in the vacuum vessel, and impurity elements contained in the silicon having a high vapor pressure in a vacuum such as phosphorus are removed.

Abstract: A refining apparatus for scrap silicon using an electron beam which is suitable for recycling of scrap silicon which is formed during the manufacture of silicon products such as silicon wafers includes a vacuum chamber, a crucible installed within the vacuum chamber, a hearth which is installed next to the crucible within the vacuum chamber and which receives granular scrap silicon and which melts granular silicon by irradiation with an electron beam and which supplies molten silicon to the crucible, and a raw material supply apparatus which is installed within the vacuum chamber and which stores a prescribed amount of granular scrap silicon and supplies the stored granular scrap silicon via a chute.

Abstract: A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one element of Ag and Sb in a total amount of at most 4 wt %, and/or at least one element of Ni, Co, Fe, Mn, Cr, and Mo in a total amount of at most 0.5 wt % in order to strengthen the alloy, and/or at least one element of Bi, In, and Zn in a total amount of at most 5 wt % in order to lower the melting point of the alloy.

Abstract: In a solder paste formed by blending an alloy powder and a flux, the alloy powder is a powder mixture formed by mixing at least one powder of a Sn—Zn based alloy and at least one powder of a Sn—Ag based alloy. The alloys powders are blended so that the composition of the powder mixture is 5-10 mass % of Zn; 0.005-1.5 mass % of Ag; optionally at least one of 0.002-1.0 mass % of Cu, 0.005-15 mass % of Bi, 0.005-15 mass % of In, and 0.005-1.0 mass % of Sb; and a remainder of Sn.

Abstract: An electric field forming apparatus for a fryer includes an electrode which is disposed along an inner wall surface of an oil vat, and a power supply which supplies an alternating current at a frequency higher than a power line frequency to the electrode.

Abstract: A method of refining scrap silicon using an electron beam includes a step of selectively preparing lumps of n-type scrap silicon containing a specific impurity element as a dopant, a step of crushing the prepared lumps of scrap silicon, a step of placing the crushed silicon into a vacuum vessel, a step of irradiating the crushed silicon which was placed into the vacuum vessel with an electron beam to melt it and vaporize at least a portion of the impurity element, and a step of solidifying the resulting silicon.

Abstract: The rate of decrease of an oxidation suppressing element in a solder bath is measured during a soldering operation. Soldering is then carried out while replenishing the solder bath is then replenished during soldering so as to maintain the surface level of molten solder in the bath with a replenishment solder alloy which supplies the oxidation suppressing element to the solder bath at at least the rate at which the oxidation suppressing element is consumed during soldering. When the oxidation suppressing element is P, the concentration of P in the replenishment solder alloy is preferably 60-100 ppm.

Abstract: A manufacturing method for a material increases the effectiveness of a component so the component can be present in an amount which does not produce undesirable effects. A material is prepared containing the component in a first concentration. The component is at least partially removed to lower the concentration of the component to a second concentration. The concentration of the component may then be increased to a third concentration above the second concentration.

Abstract: A clamping apparatus includes a frame and a pair of opposing clamping arms mounted on the frame for movement towards and away from each other to grasp or release a load. In one embodiment, each clamping arm is guided for movement with respect to the frame by an adjustable bushing which can be rotated to adjust the position of the bushing with respect to the clamping arm. In another embodiment, each clamping arm defines a four-bar linkage which controls the angle with respect to the vertical of a contact portion of the clamping arm. The clamping apparatus may be mounted on a lift truck or other support member by a connector which permits the angle of the clamping apparatus with respect to the horizontal to be adjusted and which enables the clamping apparatus to pivot about an axis between a position in which it is disposed outboard of the axis and a position in which is it disposed forward of the axis.

Abstract: A method of interconnecting terminals so as to obtain an excellent electrical connection between terminals such as opposing electrodes and a mounting method for semiconductor devices using this connecting method are provided. Electrode pads 21 of a semiconductor chip 20 and lands 11 which are provided on a substrate 10 so as to correspond with the electrode pads 21 are placed so as to oppose each other with an electrically conductive adhesive therebetween. Then, the electrically conductive adhesive is heated to a temperature which is higher than the melting point of electrically conductive particles contained in the electrically conductive adhesive and at which a resin is not completely cured, and the electrically conductive particles are bonded to each other. Then, the semiconductor chip 20 and the substrate 10 are secured by completely curing the resin in the electrically conductive adhesive.

Abstract: Non-destructive testing is performed on individual pieces of scrap silicon using an energy dispersive x-ray fluorescent analyzer to determine from the obtained spectral data whether a prescribed impurity element is contained therein. The electrical resistivity of each piece of scrap silicon can be measured, and the concentration of the impurity element contained in the scrap on can be calculated from the resistivity.

Abstract: A mold for molding is provided from which gas release can easily take place at the time of molding a foam body, which can minimize the amount of formation of burrs, and which can be easily processed. It is a mold for foam molding comprising a mold body comprising an upper mold half and a lower mold half, upper and lower outer peripheral portions provided on the peripheral portions of the upper and lower mold halves, and sealing surfaces provided on the contact surfaces of the upper and lower outer peripheral portions. A plurality of grooves are provided so as to surround the mold body on at least one of the sealing surfaces provided in the outer peripheral portions of the upper mold half and the lower mold half, and a tube for storing gas is embedded in the outermost groove of the plurality of grooves.

Abstract: A pouring apparatus for molten metal includes a stirrer installed in a reservoir. The stirrer is rotated by a rotational drive mechanism installed on the reservoir. Molten solder is placed into the reservoir, high melting point metal particles are charged into the molten solder, stirring is performed with the stirrer to uniformly disperse the metal particles in the molten solder, and then the molten solder and dispersed metal particles are cast into a mold. Casting can be performed quickly after charging the metal particles into the molten solder, so the metal particles do not significantly melt into the molten solder.