Abstract: A static random access memory cell includes a metal hi-k layer; a poly-SiON gate stack over the metal hi-k layer; a plurality of inverters disposed within the poly-SiON gate stack; and a plurality of field effect transistors placed in the metal hi-k layer.
Type:
Grant
Filed:
May 22, 2008
Date of Patent:
November 2, 2010
Assignee:
International Business Machines Corporation