Patents Represented by Attorney Micheal Plimier

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  • Composite patterning integration
    Patent number: 6924070
    Abstract: Method and structure for masking are disclosed. In one embodiment, a thin layer of radiation sensitive material is combined with another layer of radiation opaque material with different etch selectivity to facilitate a multi-stage patterning treatment of an underlying mask layer and a resultant critical dimension in the patterned mask which may be less than that available using conventional patterning techniques.
    Type: Grant
    Filed: March 19, 2003
    Date of Patent: August 2, 2005
    Assignee: Intel Corporation
    Inventor: David H. Hwang