Abstract: A thermally conductive planar member is in thermally conductive communication with a flip chip encapsulated within a dielectric material that surrounds portions of the thermally conductive planar member, the flip-chip, and a predefined portion of a substrate member. The present invention provides a flip chip package having pick-and-place capability without the thermal resistance disadvantage of capped chip packages.
Type:
Grant
Filed:
September 17, 1996
Date of Patent:
March 10, 1998
Assignee:
International Business Machines Corporation