Abstract: A replaceable heated end effector (100) can be quickly connected and disconnected to a vacuum ported tool changer (199) on a high speed machine for picking and placing electronic components. The modular end effector is made up of an adapter flange (110), a heater plate (120) and a heated tip (130). The heater plate contains one or more heating elements (410) to heat up the tip. The upper side (112) of the adapter flange mates with the vacuum ported tool changer so as to be easily removable. The adapted flange also has electrical contacts (142) to supply power to the heating elements on the heater plate. The heated tip has a vacuum pickup portion (132) that is designed to pick up the electronic components (198) and heat them while they are being transported to the placement location. There are holes or apertures (115, 125, 135) in the adapter flange, the heater plate and the heated tip that port the vacuum from the tool changer to the vacuum pickup tip.

Abstract: According to the present invention, by setting the logic state of one or more delay signals to appropriate values, the resistive value of a plurality of power supply delay elements throughout an integrated circuit having distributed circuit blocks may be modified to produce desired delay times or pulse width adjustments throughout the integrated circuit. Setting delay signals to desired logic states may be accomplished by a variety of means including forcing test pads to a logic level, blowing fuses, or entering into a test mode.

Abstract: A power MOSFET suitable for use in RF applications and a method for making the same is disclosed. The power MOSFET reduces the gate coverage of the drain region of the device in order to decrease the device gate to drain capacitance Cgd. A significant portion of the gate overlaying the drain region is eliminated by the removal of a portion of a polysilicon layer that is disposed over a substantial portion of the drain region that resides between the channel portions of the body regions of the device. The resulting open area, that is subsequently covered by an oxide layer, separates the polysilicon gate electrodes of the device. Finally, a metal layer is deposited over the entire structure to form the gate and source electrodes of the device.

Abstract: A high-gain comparator has a built-in hysteresis offset voltage generation feature. The comparator is characterized as having several elements, including a differential amplifier pair that is provided with first and second input voltages, an offset voltage element that creates an offset voltage between the first and second elements of the differential amplifier pair, an output generation element operably coupled to the differential amplifier pair that generates an output voltage of the comparator which is indicative of a voltage difference between the first and second input voltages, and a control element operably coupled to the output signal that controllably adjusts the offset voltage from a first state to a second state in accordance with the output signal to create a hysteresis condition of the comparator.

Abstract: The invention relates to an improved adaptive spectral estimator for estimating the spectral components in a signal containing both an information signal, such as speech, and noise. A method and system provide for generating noise estimates and then only updating the noise estimates during pauses in an information signal, when speech or other information is not detected, rather than continuously updating the noise estimates. A noise estimate is calculated for each frequency band and provides for the inclusion of a variable mathematical factor that can be set by the user to produce the best sound quality.

Abstract: A process monitor test chip and methodology allows process-related manufacturing defects to be quickly identified and isolated. A basic circuit block of a test chip having a number of inverter cells serially connected with a corresponding number of observation points before the input of each inverter cell provides for the inverter cells in the basic circuit block to be probed and thus observed by e-beam technology. Any required number of basic circuit blocks may be serially connected end to end to constitute a chain circuit. Within the test chip itself, a plurality of chain circuits may be connected serially or in parallel to accomplish different testing goals. By controlling an input signal and a control signal of a multiplexing element associated with each chain circuit, the plurality of chain circuits can be forced into a serial connection or a parallel connection.