Patents Represented by Attorney Michelle Simpson

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  • Process for exposing solder bumps on an underfill coated semiconductor
    Patent number: 7338842
    Abstract: A process for applying a solvent-free underfill onto a bumped semiconductor comprises: providing an underfill in a compressible state on a semiconductor, contacting the underfill with a compliant surface and applying sufficient pressure to expose the bumps, optionally hardening the underfill to a solid state, and removing the compliant surface.
    Type: Grant
    Filed: July 22, 2005
    Date of Patent: March 4, 2008
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Raghunandan Chaware, Christopher Dominic