Patents Represented by Attorney Mikiio Ishimaru

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  • System for fabricating an integrated circuit package on a printed circuit board
    Patent number: 7306133
    Abstract: A system is provided for reflow soldering a part that includes: replacing air around an unsoldered part with a first inert gas; removing the first inert gas to form a vacuum around the unsoldered part; vacuum reflow soldering the unsoldered part to form a reflow-soldered part; providing a second inert gas to fill the vacuum around the reflow-soldered part; and replacing the second inert gas with air around the reflow-soldered part.
    Type: Grant
    Filed: April 16, 2004
    Date of Patent: December 11, 2007
    Assignee: ST Assembly Test Services Ltd.
    Inventors: Yonggang Jin, Shelley Yong, Puay Gek Chua, Won Sun Shin