Patents Represented by Attorney Mikio Tshimaru

Find this attorney in the Justia Lawyer Directory

  • Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof
    Patent number: 7888184
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a shaped platform with a conductive post; mounting the shaped platform with the conductive post over a temporary carrier; mounting an integrated circuit device over the temporary carrier; encapsulating the conductive post and the integrated circuit device; removing a portion of the shaped platform isolating the conductive post; and removing the temporary carrier.
    Type: Grant
    Filed: May 27, 2009
    Date of Patent: February 15, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Il Kwon Shim, Seng Guan Chow, Heap Hoe Kuan, Seung Uk Yoon, Jong-Woo Ha