Patents Represented by Law Firm Morgon, Lewis & Bockius LLP
  • External terminal fabrication method for semiconductor device package
    Patent number: 5895231
    Abstract: An external terminal fabrication method for a ball grid array (BGA) semiconductor package for directly forming a bump on a substrate includes the steps of forming a plurality of conductive islands spaced from each other on an upper surface of a substrate, forming a photoresist film on the substrate, exposing the respective islands through the photoresist film, forming a conductive bump member on each of the exposed islands, and removing the photoresist film remaining on the substrate.
    Type: Grant
    Filed: October 29, 1997
    Date of Patent: April 20, 1999
    Assignee: LG Semicon Co., Ltd.
    Inventors: Jong Hae Choi, Jin Sung Kim