Abstract: On one surface of a disk substrate, a first dielectric layer, a thin recording layer, a second dielectric layer and a reflecting layer are cumulatively formed. The second dielectric layer is thinner than the first dielectric layer and is 35-70 nm thick. The reflecting layer is 70-120 nm thick. The total thickness of the four layers is 250-430 nm. The compressire stress of the layers is offset by tensile stress generated by an overcoat resin protective layer, formed on the reflecting layer. A method of using the optical recording medium applies the MCAV (Modified Constant Angular Velocity) recording method which records information by changing recording frequencies in accordance with linear velocity. The linear velocity is 5-12 m/s. A ratio of an inner circumference recording pulse width to an outer circumference recording pulse width is 1.2 or more.