Abstract: A test system of the present invention is suitable especially for a reliability test. A reader (23) for reading a wafer identification code attached to a wafer (W) and a reader (24) for reading a shell identification code (14) attached to a test shell (1), are provided for an aligner (2). A reader (36) for reading the shell identification code (14) is provided for a rest apparatus. A transmission system (41) is provided, through which information read by the readers (24, 36) are exchanged between the aligner (2) and the test apparatus (3). A storage devices (25b, 34b, 35b) are used for storing the information. Owing to the use of these structural elements, the IC chips formed on a semiconductor wafer can be accurately tested with high efficiency. The test shell used in the test can be disassembled accurately and reliably.