Patents Represented by Attorney, Agent or Law Firm Muramortsu & Associates
  • Packaging and interconnection of contact structure
    Patent number: 6255585
    Abstract: A packaging and interconnection for connecting a contact structure to an outer peripheral component with a short signal pass length to achieve a high frequency operation.
    Type: Grant
    Filed: January 29, 1999
    Date of Patent: July 3, 2001
    Assignee: Advantest Corp.
    Inventors: Mark R. Jones, Theodore A. Khoury