Patents Represented by Attorney Murmatsu & Associates

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  • Electrostatic chuck and substrate fixing method using the same
    Patent number: 7394640
    Abstract: The electrostatic chuck 101 where pairs of electrodes 3a/3b, 4a/4b and 5a/5b to which voltages are applied are embedded in the main body 1, and where a substrate 110 is placed and held on the surface of the main body 1, includes a first electrode group constituted of one pair or more of electrodes 3a/3b arranged in a center region 41 inside the main body 1, and a second electrode group constituted of one pair or more of electrodes 4a/4b and 5a/5b arranged in outer peripheral portions 42 and 43 surrounding the center region 41.
    Type: Grant
    Filed: March 23, 2005
    Date of Patent: July 1, 2008
    Assignee: Advantest Corp.
    Inventor: Hirofumi Hayakawa