Abstract: A process for fabricating an electronic package for a Thermally Enhanced BGA package including the steps of fabricating a thermally conductive support member, an adhesive bonding member, and a circuitized member; sandwiching the members together, forming a cavity therein; bonding adhesively the members together with heat and pressure; bonding adhesively a chip to the support member within the cavity; and connecting electrically the chip to the circuitized member. A process for fabricating an electronic flip chip package, including the steps of fabricating an adhesive bonding member, a flip chip, and a circuitized member; aligning the members with respect to each other; sandwiching the members together; bonding the members together with heat and pressure; and connecting electrically the flip chip to the circuitized member.

Abstract: An electronic package substrate for an electronic package that includes an adhesive bonding member having two planar surfaces and an orifice there through for receiving a chip and a circuitized member having two planar surfaces, one surface being bonded to one of the planar surfaces of the bonding member, the circuitized member being electrically connectable to the chip. The electronic package substrate is fabricated for an electronic package for either a wire bonded chip, a tab bonded chip, or a flip chip.