Abstract: A method of bonding two substrates at least one of which is a rubbery polymeric material having carbon-carbon double bonds on the polymer backbone, the method comprising:
a) applying an aqueous polyurethane dispersion adhesive composition to at least one of the substrates, the adhesive compostion further comprising an epoxy resin;
b) allowing the composition to dry; and then
c) joining the substrates with heating to activate the adhesive. The substrates are suitably footwear materials such as a molded rubber outer sole which has been first primed with a chlorinating primer, and a foam midsole of a material such as a lightly crosslinked ethylene vinyl acetate. The process results in bonded assemblies having improved humidity resistance.
Type:
Grant
Filed:
December 8, 1998
Date of Patent:
September 11, 2001
Assignee:
H. B. Fuller Licensing & Financing, Inc.
Inventors:
Yuduo Zhu, Robert J. Duff, Peter Gottschalk, Brian L. Marty